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제목 미르기술, 3D AOI 장비인 MV-9 Series로 EM ASIA INNOVATION AWARD 수상
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  MV-9 3D AOI SERIES    MIRTEC Innovation Award 12.jpg

미르기술이 최신 기술의 3D AOI MV-9 시리즈로 권위있는 EM 아시아 혁신상을 수상

2012년 4월 26일

검사기술의 글로벌 리더인 미르기술이, 혁신적인 3D AOI MV-9 시리즈로 2012년도 EM 아시아 혁신상 - AOI 측정/검사 시스템 부문을 수상했습니다. 시상식은 넵콘 차이나(상하이) 기간인 4월 26일 열렸습니다. 2006년에 시작된 EM 아시아 혁신상 프로그램은 아시아의 다양한 제조업 분야에서 괄목할만한 성과를 거둔 회사들에게 수여되는 상입니다.

MV-9 시리즈는 15 Mega Pixel ISIS 비전 시스템을 장착하여 보다 빠르고 정확한 검사가 가능합니다. 뿐만 아니라 2D/3D 동시 검사가 가능한 OMNI-VISION 검사 시스템으로 디바이스의 정확한 높이, 부피를 측정하여, 정확도의 향상을 이뤘습니다. 

 

 



MIRTEC RECEIVES PRESTIGIOUS EM ASIA INNOVATION AWARD FOR ITS TECHNOLOGICALY ADVANCED MV-9 3D AOI SERIES

Apr 26, 2012 

MIRTEC, “The Global Leader in Inspection Technology”, announces that it has been awarded the 2012 EM Asia Innovation Award in the category of Test & Measurement / Inspection Systems – AOI for its revolutionary MV-9 3D AOI Series. The award was presented to the company during an April 26, 2012 ceremony in Shanghai during NEPCON China 2012. Established in 2006, the EM Asia Innovation Awards program recognizes top performing companies for achieving the highest standards in the various manufacturing-related products, materials and equipment in Asia.

The new MV-9 AOI machines are configured with MIRTEC’s exclusive 15 Mega Pixel ISIS Vision System. This revolutionary optics system is comprised of a 15 Mega Pixel Top-Down Camera and a Precision Telecentric Compound Lens. This proprietary vision system is designed and manufactured by MIRTEC for use with its complete product range of inspection equipment. ISIS is an acronym for Infinitely Scalable Imaging Sensor.  As the name implies, the resolution of the ISIS Vision System may be scaled or modified to address the specific inspection requirements of virtually any production environment without sacrificing speed or performance.

 

 

MIRTEC’s revolutionary Omni-Vision 3D Inspection System provides true 3D inspection of SMT devices on finished PCB assemblies using a total of four (4) Digital Multi Frequency Moiré Inspection Probes. This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as solder volume post reflow.  Fully configured, the new MIRTEC MV-9 machines also feature four 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel Top-Down Camera.

 

Brian D’Amico, President of MIRTEC’s North American Sales and Service Division stated: "We are very proud to receive the 2012 EM Asia Innovation Award on behalf of MIRTEC’s extremely talented engineering team for their outstanding performance in the design and development of our new MV-9 3D AOI Series. We are confident that this Advanced Technology will not only provide unprecedented speed and performance to the electronics inspection industry, but will undoubtedly set a new standard by which all other inspection equipment will be measured.”

 

MIRTEC is a leading global supplier of automated optical inspection systems to the electronics manufacturing industry.  For further information, please visit www.mirtecusa.com.