|제목||MIRTEC to Exhibit the Revolutionary APLHA Series in the 3D AOI Arena, productronica 2019|
MIRTEC to Exhibit the Revolutionary APLHA Series in the 3D AOI Arena, productronica 2019
November 2019 – MIRTEC, ‘The Global Leader in Inspection Technology’, announces that the company will premier its all-new ALPHA System Series and their other outstanding inspection systems at productronica 2019. New to this event, Messe München and Konradin Verlag have organized a 3D AOI Arena in Hall A2. Leading 3D AOI manufacturers such as MIRTEC will demonstrate their latest 3D Inspection Technology at this four day event scheduled to take place November 12th thru 15th 2019, at the Munich Trade Fair Center in Munich, Germany.
“We are very excited about the products that we will be presenting at productronica 2019,” stated Holger Hansmann, Sales/Marketing Director of MIRTEC Germany GmbH. “MIRTEC will feature a total of five (5) 3D Inspection Systems specifically designed to address the full spectrum of inspection requirements associated with the electronics manufacturing industry. Four (4) systems will be displayed at our booth, and one special system will be on the 3D AOI Arena.”
Revolutionary Hybrid 3D Inspection Technology
Moiré fringe pattern projection technology is widely used for 3D AOI as it is easy to implement, and is suitable for many applications. This technology, however, is not without limitations. Increased complexity and density of modern PCB designs have led to higher instances of “shadowing” in which lower lying devices are obstructed by taller adjacent components. This, combined with the prolific use of highly reflective devices and materials within the electronic manufacturing process, can cause Moiré fringe pattern projection technology to fall short of fulfilling the needs of critically demanding applications. Attempts to overcome these limitations by adding more projectors, predictive algorithms and the heavy use of data filtering leads only to higher costs, slower processing speeds and distortion of the true data, leading to less accurate results.
MIRTEC’s all-new ALPHA_AOI System was designed to specifically address the most demanding inspection requirements. The ALPHA_AOI machine is configured with MIRTEC’s proprietary Hybrid 3D Inspection Technology which provides uniform precision measurement across the entire 3D measurable range regardless of external factors such as PCB density and material characteristics. This revolutionary technology yields superior edge definition and requires substantially less software filtering of raw inspection data than competitive systems. Less distortion of raw data simply translates to superior inspection performance which is especially crucial for accurate solder joint inspection.
All-new ALPHA_SIP is also configured with 3D Hybrid Technology. Furthermore, it’s equipped with a special sensor to find defect in the mirror-like CSP components and light-absorbing materials such as GaAs(Gallium arsenide). As its name suggests, the ALPHA_SIP is designed to use at the SiP (System in Package) manufacturing industry, but this sophisticated system also can be applied to SMT manufacturing industry. Due to its 25 Mega Pixel CoaXPress Vision System, 7.7㎛ super precision lens and 3D Hybrid Technology applied ALPHA Optical System, ALPHA_SIP shows great performance especially when inspect high-dense components.
Stable and Reliable Standard SMT Inspection Systems
The Award Winning 3D AOI Machine, MV-6e OMNI and MV-9DL are configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology which combines our 25/15 Mega Pixel CoaXPress Camera Technology with MIRTEC’s revolutionary Digital Multi-Frequency Quad Moiré 3D system in a cost effective platform. MIRTEC’s 25/15 Mega Pixel CoaXPress Vision System is a proprietary camera system designed and manufactured by MIRTEC for use with our complete product range of 3D inspection systems. MIRTEC’s Digital Multi-Frequency Quad Moiré Technology, provides true 3D inspection using a total of four (4) Programmable Digital Moiré Projectors to yield precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured the MIRTEC 3D AOI machines feature four (4) 18 Mega Pixel Side-View Cameras in addition to the 25/15 Mega Pixel Top-Down Camera. There is little doubt that this new technology has set the standard by which all other inspection equipment is measured.
The MV-9DL machine is premium dual-lane full 3D AOI machine that specialized for automotive electronics inspection. The MV-9DL is configured with linear motor drive robot system for and dual lane conveyor system, so that it secures repeatability and inspection speed both. Also, a special OCR and solder inspection algorithms that exclusively developed for automotive electronics manufacturing are applied to the MV-9DL.
MIRTEC’s Award Winning MS-11e 3D SPI Machine is configured with MIRTEC’s exclusive 15MP CoaXPress Vision System, providing enhanced image quality, superior accuracy and incredibly fast inspection rates.
The machine uses Dual Projection Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste depositions on PCBs post screen print for dent and void solder in addition to insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. The MS-11e uses the same robust platform as MIRTEC’s MV-6e OMNI Series.
Smart Inspection Software based on Artificial intelligence based Deep Learning Methodology
MIRTEC’s Automatic Programming Software uses Artificial intelligence based Deep Learning Methodology to minimize human error and standardize the programming process. This advanced software solution automatically analyzes the PCB architecture and assigns the appropriate part type and process parameters for each SMT device thereby maximizing programming efficiency. Only basic operator training is required to achieve optimal inspection results.
MIRTEC’s ‘Best-in-Class’ Optical Character Recognition (OCR) Technology reduces false calls and improves production process efficiency by automatically restoring and inspecting damaged characters through AI and Deep Learning.
Leading the Way to Industry 4.0
MIRTEC’s Total Remote Management System (TRMS) is a fully integrated Industry 4.0 Solution which combines remote management with real-time data monitoring and analysis for each system within the SMT production line. MIRTEC’s TRMS provides real-time remote monitoring of status information and statistical data such as; equipment operation status, production yield, PC resources, temperature, humidity, etc.
The combination of MIRTEC’s 3D AOI and TRMS systems provide a vast improvement in production process management over common AOI technologies and management software. The TRMS Module is a key part of MIRTEC’s Intelligent Factory Automation System. This powerful software suite was designed and developed by MIRTEC to provide manufacturers with a clear view into the manufacturing process, thereby helping them achieve higher operating efficiencies and improved quality.
“MIRTEC has earned a reputation as one of the most progressive and dynamic suppliers of inspection equipment to the Electronics Manufacturing Industry”, stated Chanwha Pak, CEO of MIRTEC Co LTD. “productronica is an event that brings together the latest 3D Automated Optical Inspection Technology from every major AOI manufacturer throughout the world. We are very excited to present our Technologically Advanced APLHA_AOI System at this year’s event. We look forward to welcoming visitors to our booth #413 in Hall A2 and at the 3D AOI Arena as well.”
MIRTEC is a leading global supplier of automated inspection systems to the Electronics Manufacturing Industry. For further information, please visit www.mirtec.com