We created the ART to overcome specular reflection and blind spot problem, which are obstacles to
inspect exact solder height and shape in 3D, critical inspection item in high-end electronic manufacturing industry.
Configured withTotal 75 Megapixels 5-way cameras and Full HD digital Moiré 3D projections,
the ART can acquire 3D data from all around of the inspection target, 5 times more than traditional 3D AOI systems.

ART can avoid 3D measurement failures due to specular reflection on shiny solder surface,
because side cameras compensate for 3D inspection when the top-down camera fails.
For the same reason, there’s no blind spot in 3D measurement for the ART.

Due to its multiple camera angles, ART can inspect solder joint within shadow areas more easily than conventional 3D AOI systems.

MIRTEC's patented Digital Blue Moiré Technology enables precise 3D inspection across a wide range (0 to 25 mm)
using a combination of high, medium, and low-frequency fringe patterns.
It ensures stable inspection quality, regardless of the color or brightness of the object within the FOV.

All MIRTEC 3D AOIs are equipped with an 8-phase color lighting system, including coaxial lighting, which consists of coaxial white,
primary vertical white, secondary vertical white, horizontal white, blue, red, green, and yellow.
This ensures optimal inspection conditions at all times, regardless of the PCB or the inspection object's color and material.

Equipped with an internal flipper for double-sided PCB inspection,
the system allows you to inspect both the top and bottom of a PCB without requiring external equipment.