MV-6TB

3D/2D AOI

MV-6TB

Dual-Side Simultaneous Inspection System

  • Shorten Tact Time

    Shorten
    Tact Time

     
  • Minimize Space

    Minimize
    Space

     
  • 70㎜ Tall parts Inspection

    70㎜
    Tall Parts
    Inspection

     
  • Production Speed Boost

    Production
    Speed Boost

     


Product Features


The MV-6TB enables simultaneous top and bottom inspection within a single system, eliminating the need for sequential inspection processes.
With true one-pass inspection, manufacturers can significantly reduce inspection cycle time while improving overall line tact time. By consolidating inspection processes into a single platform, the system also optimizes production line layout and maximizes valuable factory floor space.
The MV-6TB is an ideal solution for high-speed SMT lines and high-volume manufacturing environments where productivity
and efficiency are critical.


The MV-6TB offers a highly flexible inspection platform designed to adapt to various production environments.
It supports multiple manufacturing processes including SMT, THT, and PBA, allowing manufacturers to configure
inspection processes according to their specific production requirements.
This flexibility enables manufacturers to optimize line configuration and respond quickly to evolving manufacturing needs.

The MV-6TB features a powerful Dual PC Architecture that independently controls top and bottom inspections.
By processing inspection data in parallel, the system dramatically increases data processing speed and maximizes inspection throughput.
This architecture enables the MV-6TB to achieve both high-speed inspection and
high-accuracy detection simultaneously—delivering a premium inspection platform built for performance, stability, and productivity.

By incorporating Z-axis movement in the optics and adding a GPU to the system, the MV-6TB can inspect tall parts up to 70mm, exceeding the measurement limits of 25mm in conventional 3D AOIs.

Four high-resolution side cameras enable side-view OCR inspection and solder inspection of J-leads, coils, and QFNs, which are challenging to inspect from a top-down perspective.

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