MIRTEC, the Global Leader in 3D Inspection Technology, is pleased to announce that MIRTEC will attend Nepcon Japan 2023, January 25-27 at the Tokyo Big Sight in Tokyo, Japan.

At the Exhibition, MIRTEC will display our complete line of 3D Inspection Systems including our Award-Winning MV-6 OMNI DL 3D AOI System with Dual Side Inspection (DSI-1).  

This revolutionary 3D AOI System is specifically designed for customers with low-to-medium volume batch/cell production requirements providing automatic consecutive 3D Inspection of both PCB sides within one low-cost platform. For maximum efficiency, the MV-6 OMNI DL may be configured with a PCB Magazine Loader/Unloader. 

New to Nepcon Japan 2023, MIRTEC will display our GENESYS-CC AI-Based Conformal Coating AOI System.  

The GENESYS-CC machine inspects for Presence/Absence of Conformal Coating, AI-Based Bubble Inspection, and Lateral Side Component CC Inspection using the 18MP Side Cameras. The system is also fully capable of standard PCB inspection, providing maximum flexibility to the Electronics Manufacturing Environment. 

✅ Check the Exhibition Details

NEPCON JAPAN - January 25-27, 2023 at Tokyo