Hybrid 3D SiP Inspection Technology

SiP (System in Package) consists of bonded components with varying characteristics, requiring a combination of multiple inspection techniques for optimal results.
MIRTEC's Hybrid 3D SiP Inspection Technology integrates a high-performance vision optical system, Moiré 3D inspection, and Laser Scanning 3D inspection to ensure comprehensive and precise evaluation.

The best inspection quality is ensured in any environment by selecting and applying the most suitable solution from three inspection methods, each with distinct optical properties, depending on the size, shape, and surface material of the object being inspected.

12 Projection Digital Blue Light Moiré

MIRTEC's patented 12-Projection Digital Blue Light Moiré technology enables precise and stable 3D inspection, unaffected by the color of the part or substrate. This technology is especially effective for inspecting small, high-density components and maintains measurement accuracy even on curved surfaces, such as solder fillets.

Hybrid Blue Laser Scanning

Objects with highly reflective or extremely low-reflective surfaces are challenging to inspect using conventional optical methods—but MIRTEC overcomes this limitation.

MIRTEC’s Hybrid Laser utilizes high-energy, straight-line blue light to create clear pattern lines, even on light-absorbing, low-reflective surfaces.
On highly reflective surfaces, the short wavelength of the blue laser causes light to scatter, allowing the top camera to accurately recognize the pattern lines.
As a result, the MV-9SiP performs precise 3D inspections without issue, even for highly reflective CSPs and dark-colored parts.

25M 7.7㎛ High Resolution Camera

MIRTEC has implemented a next-generation vision system featuring 7.7㎛ high-resolution lenses for greater precision and stability in inspection.
Additionally, the CoaXPress interface enables high-speed inspection, while the 25M high-resolution camera provides a large field of view (FOV) for enhanced performance.

8 Phase Coaxial Color Light

All of MIRTEC's 3D AOIs come standard with Coaxial Lighting, which is highly effective for inspecting CSP parts, a significant portion of SiP inspection targets.
For CSP parts with high surface reflectivity, cracks are often undetectable in 3D inspection and may also go unnoticed in 2D inspection due to reflection angle issues with conventional lighting.
However, Coaxial Lighting clearly highlights cracks, making detection easy and reliable.

Want to know more?

Please contact us if you want to know more abut the MV-9SIP system.