宣传资料

MIRTEC, a global leader in inspection technology, proudly announced the successful conclusion of its participation in SEMICON West 2026, held from October 13 to 15, 2026, at the Moscone Center in San Francisco, California.

Throughout the exhibition, MIRTEC showcased its advanced 3D semiconductor inspection systems, MV-9SiP and MS-15 Bump, at Booth #6162, attracting strong interest from semiconductor and electronics manufacturing professionals worldwide.

The event provided an excellent opportunity for MIRTEC to highlight its high-precision 3D inspection technologies and innovative solutions designed to meet the evolving demands of semiconductor manufacturing. It also served as a valuable platform for engaging with global customers and industry experts on improving inspection accuracy, manufacturing quality, and production efficiency.

Among the featured systems, the MV-9SiP Hybrid 3D Inspection System combines 2D vision, 12-projection Digital Blue Light Moiré, and Blue Laser Scanning technologies into a single advanced semiconductor inspection platform. Equipped with a 25MP high-resolution vision system and 8-phase coaxial color lighting, the MV-9SiP enables precise inspection of fine-pitch solder balls, bumps, and densely packed semiconductor packages while delivering reliable 3D measurements across surfaces with varying reflectivity.

Also on display, the MS-15 Bump is a high-precision 3D SPI system developed for advanced semiconductor and high-density SMT applications. Featuring a 25MP high-resolution camera and Dual Projection technology, the system provides accurate measurement of ultra-fine pads and solder bumps. Its integrated Closed-loop System further enhances process stability and manufacturing productivity.

Throughout the three-day event, MIRTEC welcomed customers, business partners, and industry professionals from across the semiconductor and advanced electronics manufacturing sectors. Visitors showed particular interest in MIRTEC's capabilities for addressing complex inspection challenges involving advanced semiconductor packaging, fine-pitch bumps, and high-density manufacturing applications.

“SEMICON West 2026 was a valuable opportunity to connect with semiconductor industry professionals from around the world and demonstrate MIRTEC's advanced inspection technologies,” said a MIRTEC representative. “The event also allowed us to exchange insights on the evolving inspection requirements of next-generation semiconductor manufacturing. We remain committed to continuous innovation and delivering advanced inspection solutions that help our customers achieve greater quality, productivity, and manufacturing reliability.”

MIRTEC extends its sincere appreciation to all customers, partners, and industry professionals who visited its booth during SEMICON West 2026. Moving forward, the company will continue to strengthen its technological capabilities and global partnerships, further reinforcing its position as a leading provider of advanced inspection solutions for the semiconductor and electronics manufacturing industries.